Explanation of Equipment:
1 Equipment type 1: Photolithography, ozone cleaning, furnace oxidation/diffusion, UV-curing conveyor, electroplater, contact angle analyzer, 3D printer, inverted microscope, suss spinner, laser cutter, hot roller, mini-labo coater, bio-dot printer, and wire bonder.
2 Equipment type 2: Thermal evaporator, SEM sputter coater, Parylene coater, wabash press, RTA, and substrate bonder.
3 Equipment type 3: Scanning electron microscope, reactive ion etcher, ICP etcher, AFM, ellipsometer, probe station electrical measurement, contour microscope, injection molding, 5-axis milling, profilometer, GC-MS, and nano-imprint lithography.
4 Equipment type 4: Metallization - E‐beam evaporation and sputtering.
Explanation of process charged "per run":
Processes such as evaporation and Parylene coating take large amounts of time due to time spent preparing the system or processes that take a long time to complete. The major expense with these processes is in the materials. In addition, a single "run" can typically process multiple substrates.
Explanation of process charged "per hour":
Processes such as scanning electron microscopy and photolithography take a wide range of times to operate depending on the users skill and the difficulty of the process.
The cost to the ERC Clean room is in terms of consumable parts in the equipment or process.
Thus, the longer the equipment is used the more parts are consumed.
Explanation of non-academic use of clean room equipment:
External users will pay external rates for access and for use of all equipment.