Karl Suss MJB 3 Mask Aligner

Karl Suss MJB 3 Mask Aligner

Karl Suss MJB 3 Mask Aligner

General Information

Equipment Name: Karl Suss MJB 3 Mask Aligner

Location: 354 ERC

Max Wafer Size: 3”

 

System Information

General Description: The MJB 3 is designed for high resolution photolithography in a laboratory or pilot plant production. It offers flexibility in handling of irregularly shaped substrates of differing thickness as well as standard sized substrates up to 3” diameter. 

Capabilities:

  • Mask size: 2.5 inch 3 inch and 4 inch
  • Substrate sizes:  pieces to 75 mm
  • Range of alignment: X, Y ± 10mm and Theta ± 10°
  • Substrate movement is performed with high precision micrometers for X, Y, and Theta axis resolution of 0.1μm
  • Alignment accuracy: 0.1μm for top side alignment (with 20x objectives)
  • Exposure modes: soft contact, hard contact, and vacuum contact
  • Print resolution: Soft contact: 1.0 – 2.0μm Hard contact: 0.8 – 1.5μm,  and Vacuum contact: 0.6μm
  • 350 mercury arc lap with a UV filters for 365 nm and 405 nm wavelength

 

Useful System Links

Equipment Use Fees

Internal $10/hour External $30/hour

Staff time: Internal: $40/hour External: $80/hour

Documentation

Operators Manual

SOP