Equipment Name: Plasma-Preen II-973 Cleaner/Etcher
Max Wafer Size: 7”
General Description: Plasmatic Systems, Inc. has developed a method of using microwave energy generated from a microwave oven to excite a plasma. In the Plasma-Preen system microwave energy is directed into a vacuum bell jar, containing the work to be processed. Controls are added to vary the analog power of the microwave radiation. The base plate is water cooled to improve substrate temperature control at high plasma densities. Microwave ovens are supplied with duty cycle and microprocessor controls already built in, which are incorporated into the Plasma-Preen system. Using a microwave oven allows for a significant reduction in the cost of the equipment to make a high power plasma cleaning equipment. Some etching applications such are polyimides, epoxy removal, photoresist stripping and descum. The Plasma-Preen can be used to clean wire bond pads, gold plated parts, ceramic substrates, glass parts, and semiconductor surfaces.
- 2.45 GHz microwave power from 100 to 550 Watts maximum to the electrode.
- Substrate is water cooled.
- Two process gases are Argon and O2 with a 15 ml/min flow meter.
- The plasma chamber is configured with a 9” x 7” x 3” rectangular Pyrex and Aluminum chamber to accommodate a wide range of wafer sizes, piece parts, IC packages and other components.
Useful System Links
Equipment Use Fees
Internal $30/hour External $60/hour
Staff time: Internal: $40/hour External: $80/hour