Technics 85 Reactive Ion Etcher

coater

Technics 85 Reactive Ion Etcher

General Information

Equipment Name: Technics 85 RIE

Location: 364 ERC

Max Wafer Size: 6”

 

System Information

General Description: The Technics RIE is designed for advanced

etching applications such as dielectric material removal, etching of oxides, nitrides, polyimides, silicon, epoxy removal, and  photoresist stripping and descum.

Capabilities:

  • An integrated supply provides 30 KHz RF at 300 Watts maximum power to the electrode.
  • Substrate temperature is controller with a Neslab Chiller ranging from -30 to 100 °C.
  • Six process gases are SF6, CF4, CHF3, Ar, O2, and N2.
  • The plasma chamber is configured with a 6” powered electrode to accommodate a wide range of wafer sizes, piece parts, IC packages and other components.

Useful System Links


Equipment Use Fees

Internal $30/run External $60/run
Staff time: $80/hour

Schedule Training 

Documentation

Operators Manual

SOP