Heikenfeld's Smartphone Sweat Sensor is Garnering National Media Attention

Excerpt from “HELLO? Sweat and a Smartphone Could Become The Hot New Health Screening” by Dawn Fuller, University of Cincinnati:

Heikenfeld with his next generation of sweat sensor pad.

Heikenfeld with his next generation of sweat sensor pad.

A University of Cincinnati partnership is reporting a significant leap forward in health diagnostics that are more accurate than what’s available today, yet considerably less invasive than something like a blood screening. It’s a lightweight, wearable device that analyzes sweat by using a smartphone. In an article published in the latest issue of IEEE Spectrum Magazine, Jason Heikenfeld, a UC professor of electrical engineering and computing systems, highlights new developments regarding the gadget that can gather vital medical information in almost real time.

Heikenfeld is head of UC’s Novel Devices Laboratory, dedicated to multidisciplinary research, primarily in electrofluidics and biosensors, spanning fundamental science to more applied work through industrial partnerships.

The sweat sensor technology research is a partnership that includes UC’s College of Engineering and Applied Science (with co-researchers Ian Papautsky, professor of electrical engineering and computer systems, and Fred Beyette, professor of electrical engineering and computer systems); the James L. Winkle College of Pharmacy (with co-researchers Gerald Kasting, professor of pharmaceutical sciences, and Kevin Li, professor of pharmaceutical sciences); the UC College of Medicine, the Air Force Research Lab (AFRL), UC’s Office of Office of Entrepreneurial Affairs and Technology Commercialization, and numerous industries, including those represented in UC’s new National Science Foundation-funded Center for Advanced Design and Manufacturing of Integrated Microfluidics (CADMIM).

IEEE Spectrum is the flagship magazine of the IEEE. With more than 400,000 members, the IEEE is the world’s largest professional organization devoted to engineering and the applied sciences.

Photo Courtesy of Colleen Kelley, University of Cincinnati

Read the full article here: http://www.uc.edu/news/NR.aspx?id=20677

NSF Science 360 News story at http://news.science360.gov/files/