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ESCI IKo FIBRotools Electroplating System

ESCI IKo FIBRotools Electroplating System

ESCI IKo FIBRotools Electroplating System

General Information

Equipment Name: ESCI IKo FIBRotools Electroplating System

Location: 918C Rhodes Hall

Max Wafer Size: 6”


System Information

General Description: The IKo is designed simply to electroplate high-resolution interconnects and fine metallic features on wafers and substrates. FIBRoplate IKo is fabricated with PVC and polypropylene with a minimum of metal parts to avoid potential contamination of electroplating solutions. Metal features are stainless and titanium. All parts can be easily disassembled for maintenance.


  • Micro/macro uniformity <5% across the wafer
  • Wafer size: 2" to 8"
  • Simultaneously processes up to three 2" wafers
  • Fast plating typically 1µm per minute
  • Uses off-the-shelf chemistries with minimal additives
  • Metals plated: Cu, Ni, Pd, Au, Sn, Pb, Pt, Fe, Ag, Permalloy, Sn/Pb, Pd/Ni
  • Current DC and pulse average: 0.1A, 1.0A, and 3.0A
  • Current peak: 0.3A, 3.0A, and 6.0A
  • Voltage:  0 – 10V
  • Programmable Timer: 4 digital realtime
  • On/off timing: 0.01 mSec to 99 sec
  • Heater:  Thermostat, 160F max., 550 Watt
  • Solution Volume: 2.1 gallons/8 liters


Useful System Links

Equipment Use Fees

Internal $10/hour External $20/hour

Staff time: Internal: $40/hour External: $80/hour

Schedule Training


Operators Manual