Equipment Name: March CS-1701 RIE
Location: 364 ERC
Max Wafer Size: 6”
General Description: The March RIE is designed for advanced etching applications such as removal of interlayer films for failure analysis, de-encapsulation and dielectric material removal, etching of oxides, nitrides, polyimides, silicon, epoxy removal, and photoresist stripping and descum.
- An ENI supply provides 13.56 MHz RF at 600 Watts maximum power to the electrode with an automatic matching network.
- Substrates are cooled with a Fisher Scientific Chiller ranging from -30 to 150°C.
- Six process gases are SF6, CF4, CHF3, Ar, O2, and N2.
- The plasma chamber is configured with a 6” powered electrode to accommodate a wide range of wafer sizes, piece parts, IC packages and other components.
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