Cleanroom & OCMI Equipment

Equipment Name: nanoSurf easyScan 2 AFM

Location: 361 ERC

Max Wafer Size: 2”

General Description: An atomic force microscope can make nanometer scale resolution measurements of topography and several other properties of a sample.

Basic Module:

• Imaging modes Static Force (Contact):  Const. Force (Topography), Const. Height (Deflection)
• Spectroscopy modes:  Force-Distance, Force-Tip voltage

Dynamic Module:

• Additional imaging modes: Dynamic Force (Intermittent Contact, etc.): Const. Amplitude (Topography), Const. Height (Amplitude)
• Additional spectroscopy modes:  Amplitude-Distance used to investigate sample surfaces.

Capabilities:

• Typical resolution 3-10nm
• Max x-y range 70 micron
• Max z range 14 micron

*Acceptable materials are any dry sample. No fluids are allowed on this system.

Equipment Use Fees:

• Internal $30/hour External $60/hour
• Staff time: Internal: $40/hour External: $80/hour

Equipment Name: First Ten Angstroms 1000 B Drop Shape Instrument

Location: 918B Rhodes Hall

General Description: Contact angles describe the shape of a fluid drop in contact with a solid. FTÅ instruments measure these by imaging the drop on a CCD camera and analyzing the captured images on a computer. Contact angle measurements are used to determine the cleanliness of surfaces, with applications from electronics materials such as semiconductors and hard disks all the way to metal working. Contact angles are also used to derive surface energy, and find application in evaluating surface treatments such as corona and plasma processing. Finally, contact angles are used to derive wettability parameters, for both absorbing and non-absorbing materials. Surface and interfacial tensions of fluids can be measured directly from drop shape. Surface tension will change in the presence of surfactants, and surfactant characteristics can be derived from these changes. Measurements can either be static, implying a sense of equilibrium, or dynamic, where they vary as a function of time. In this latter case, the change in drop volume on the surface reflects absorption.

Capabilities:

• FTA offers specialized equipment to dispense small volumes of liquids.
• Dispense heads are available for OEM inclusion into other systems. These heads include a modern software interface that allows the driver to be included into the user's Visual Basic or C++ code.
• Prosilica GC705 gigabyte Ethernet camera with a 752 x 480 pixel resolution at 62 frames per second with 0.7 – 4X magnification.
• Manual stage movement.
• 30 gauge, 27 gauge, and 20 gauge stainless steel dispensing needles.
• Drop Shape Analysis Software version 2.0 for contact angle and surface tension analysis.
• Trek 603 power amplifier.
• Tektronix AFG3022B dual channel function generator.

Useful System Links:

• First Ten Angstroms

Equipment Use Fees:

• Internal $10/hour External $20/hour
• Staff time: Internal: $40/hour External: $80/hour

Equipment Name: La Vision Micro Particle Image Velocimetry

Location: 918B Rhodes Hall

General Description: Micro-Particle Image Velocimetry (PIV) system is designed to measure velocity fields of particle seeded flows with micron scale spatial resolution using PIV techniques. The light source is typically a double pulsed Nd:YAG laser that is coupled through an optical fiber into a fluorescence microscope and focused with a high numerical aperture on a microfluidic device.

The microflow is seeded with fluorescent particles. A microscope lens collects the particle signal that has a longer wavelength than the illuminating light. This signal is separated from the laser light by a filter cube and is recorded by a double-frame CCD camera. The double frame images are evaluated with conventional PIV algorithms.

Capabilities:

• Nano S 30-30 PIV Pulsed Nd:YAG Lasers are ultra-compact and rugged offering repetition rates to 30Hz and energies up to 30mJ at 532nm.
• Repetition rate: 0 – 30 Hertz.
• Dedicated laser head and controls for PIV.
• Carl Zeiss Observer Z1m inverted research-grade material microscope with motorized stand, focus control, and 3 x optovar turrets.
• Equipped for all relevant contrasting methods.
• 6-place reflector turret for convenient change of reflector modules, with 10x, 20x, 40x, and 63x objectives.
• Automated components of the reflected light beam path providing the highest level of reproducibility.
• Contrast and light managers for automatically controlled microscope settings.
• New LED illuminating concept, no alignment and no lamp change required.
• Accurate measurements in microchannels, microfluidics, MEMS applications, and drug delivery.
• Scientific CMOS Imager with a 5.5 megapixel (2560h x 2160v) resolution and a frame rate of 100 frames/second.

Useful System Links:

• piv.de/piv/micro-piv.php
• litronlasers.com
• microscopy.zeiss.com
• scmos.com

Equipment Use Fees:

• Internal $30/hour External $60/hour
• Staff time: Internal: $40/hour External: $80/hour

Equipment Name: Olympus IX81-ZDC2 Focus Drift Compensating Inverted Microscope

Location: 918B Rhodes Hall

General Description: The IX81 represents the most advanced motorized inverted microscope from Olympus. The IX81's modular frame and optical design provides 9 access ports for multiple input or output devices. Up to four ports can have simultaneous access to a primary image. With its built-in motorized Z-axis drive, 6-position nosepiece and light path selector, the IX81 is ready for multi-wavelength, advanced fluorescence and deconvolution techniques. 

Capabilities:

• Q-imaging EXI blue CCD camera with pixel-freeze technology, 1.3megapixel, 3.63 micron monochrome pixel, 30 full frames per second, and USB2 camera (power supply not required).
•  6-place reflector turret for convenient change of reflector modules, with 4 x, 10x, 20x, 40x, and 40xw (a water immersion objective) objectives.
• Prior Proscan III X-Y stage movement.
• The 100W single condenser column has increased focus travel for newly designed relief contrast and motorized condensers.
• Single reflection, V-shaped optical path with apochromat relay lenses provides single reflection, high quality and bright images to the observation tubes.
• Frame incorporates a 1.6x magnification changer offering increased magnification to eyepieces and cameras without changing objectives.

Useful System Links:

• olympusamerica.com

Equipment Use Fees:

• Internal $10/hour External $20/hour
• Staff time: Internal: $40/hour External: $80/hour

Equipment Name: Specialty Coating PDS 2035CR Parylene Coater

Location: 918B Rhodes Hall

Max Wafer Size: 6”

General Description: The PDS 2035CR will apply Parylene conformal coating to a variety of surfaces. The thin, transparent polymer coating conforms precisely to the substrate shape, is pinhole free, has high dielectric strength, exceptionally high surface and volume resistivity, and resists moisture, acids, alkalis, petroleum products and solvents.

Parylene can be used to protect electronic circuits and components, medical devices and implantables and coat optical surfaces.

Capabilities:

• Parylene HT
• Parylene C
• Parylene N
• Parylene D
• Integrated Cold Trap

Acceptable substrate materials are metal, glass, paper, resin, plastics, textiles, ceramic, ferrite, and silicon.

Equipment Use Fees

• Internal $30/run External $60/run
• Staff time: $80/hour

Equipment Name: Specialty Coating PDS 2010 Parylene Coater

Location: 918B Rhodes Hall

Max Wafer Size: 6”

General Description: The PDS 2010 will apply Parylene conformal coating to a variety of surfaces. The thin, transparent polymer coating conforms precisely to the substrate shape, is pinhole free, has high dielectric strength, exceptionally high surface and volume resistivity, and resists moisture, acids, alkalis, petroleum products and solvents.

Parylene can be used to protect electronic circuits and components, medical devices and implantables and coat optical surfaces.

Capabilities:

• Parylene C
• Parylene N
• Parylene D
• Liquid Nitrogen Cold Trap

Acceptable substrate materials are metal, glass, paper, resin, plastics, textiles, ceramic, ferrite, and silicon.

Equipment Use Fees

• Internal $30/run External $60/run
• Staff time: Internal: $40/hour External: $80/hour

Equipment Name: Microlution 5100-S Milling Machine

Location: 919 Rhodes Hall

Maximum Work piece: 100 mm3

General Description: The 5100-S is a precision 5-axis gantry type machine tool for micro-manufacturing.  

Capabilities:

Overall Travel:

• X: 140mm (+70mm, -70mm)
• Y: 100mm (+45mm, -55mm)
• Z: 100mm
• A(tilt): -17^o/+107^o
• C(rotary): 360o Continuous

Accuracy:

• X: +/-0.001mm
• Y: +/-0.001mm 
• Z: +/-0.001mm
• A(tilt): +/-30 arcsec
• C(rotary): +/-20 arcsec

HF60 Spindle Specifications:

• Maximum speed: 70,000 RPM
• Output power: 1700 W (peak) 1300 W (continuous)
• Output torque: 0.28Nm (peak) 0.21Nm (continuous)
• Tool holder: SKI-16

Cutting Tool Support:

• Collets for 3mm, 4mm, 1/8th inch, and ¼ inch shank diameter
• Schaublin SKI-16 tool holder
• Hanfsterfer's Hard Cut NG Coolant
• Kyocera MicroTools catalog
• System 3R Macro chuck workholding
• BLUM Nano NT tool sensor

CAM Software

• Mastercam 2017
• Acceptable drawing formats are AutoCAD (DXF, DWG, DWF), IGES files (IGS, IGES), Rhino 3D (3DM), SolidWorks (SLDPRT, SLDASM, SLDDRW), SolidEdge (PAR, PSM, ASM), Stereolithography (STL), Catia V4, V5 (MODEL, EXP, CATPART), and others.

Useful System Links:

• Microlution Promo Video
• eMastercam
• Postability

Equipment Use Fees

• Internal $30/hour External $60/hour
• Staff time: Internal $40/ hour External $80/hour

Equipment Name: Nordson RIE-1701
Location: 364 ERC
Max Wafer Size: 8” 

General Description: The Nordson RIE is designed for advanced etching applications such as removal of interlayer films for failure analysis, de-encapsulation and dielectric material removal, etching of oxides, nitrides, polyimides, silicon, epoxy removal, and photoresist stripping and descum.  Also used for surface modification

Capabilities:

• An ENI supply provides 13.56 MHz RF at 600 Watts maximum power to the electrode with an automatic matching network
• Substrate temperature is controller with a Neslab Chiller ranging from -30 to 100 °C.
• Six process gases are SF₆, CF₄, CHF₃, Ar, O₂, and N₂.
• The plasma chamber is configured with a 8” powered electrode to accommodate a wide range of wafer sizes, piece parts, IC packages and other components.

Useful System Links: 

• Plasma Power Plus: plasmapowerplus.com

Equipment Use Fees:

• Internal $30/hour 
• External $60/hour 
• Staff time 
  • Internal: $50/hour 
  • External: $100/hour

Equipment Name: Plasma Therm Versaline ICP etcher

Location: 364 ERC

Max Wafer Size: 6”

General Description: The Plasma Therm Versaline ICP Etcher is a highly selective anisotropic etch system capable of etching a wide variety of materials.

Capabilities:

• A top coil is supplied with 2 MHz RF at 2000 Watts maximum and the bottom electrode is supplied with 13.56 MHz RF at 600 Watts maximum.
• Mechanical clamping of 6” silicon wafer with backside Helium cooling.
• Eight process gases are Cl2, BCl3, SF6, CF4, CHF3, Ar, O2, and H2.
• Endpoint detection uses a CCD Camera mounted on the PM chamber lid. This configuration uses a laser emission aimed through a viewport to measure intensity and reflectivity changes in the process chamber to determine endpoint.
• A wide variety of different sized substrates can be mounted to a 6” silicon wafer using Dow Corning 340 silicon thermal compound.

Equipment Use Fees 

• Internal $30/run External $60/run
• Staff time: Internal: $40/hour External: $80/hour

Equipment Name: March CS-1701 RIE

Location: 364 ERC

Max Wafer Size: 6”

General Description: The March RIE is designed for advanced etching applications such as removal of interlayer films for failure analysis, de-encapsulation and dielectric material removal, etching of oxides, nitrides, polyimides, silicon, epoxy removal, and  photoresist stripping and descum.

Capabilities:

• An ENI supply provides 13.56 MHz RF at 600 Watts maximum power to the electrode with an automatic matching network.
• Substrates are cooled with a Fisher Scientific Chiller ranging from -30 to 150°C.
• Six process gases are SF6, CF4, CHF3, Ar, O2, and N2.
• The plasma chamber is configured with a 6” powered electrode to accommodate a wide range of wafer sizes, piece parts, IC packages and other components.

Equipment Use Fees:

• Internal $30/hour External $60/hour
• Staff time: Internal: $40/hour External: $80/hour

Equipment Name: Plasma-Preen II-973 Cleaner/Etcher

Location: 918B Rhodes Hall

Max Wafer Size: 7”

General Description: Plasmatic Systems, Inc. has developed a method of using microwave energy generated from a microwave oven to excite a plasma. In the Plasma-Preen system microwave energy is directed into a vacuum bell jar, containing the work to be processed. Controls are added to vary the analog power of the microwave radiation. The base plate is water cooled to improve substrate temperature control at high plasma densities. Microwave ovens are supplied with duty cycle and microprocessor controls already built in, which are incorporated into the Plasma-Preen system. Using a microwave oven allows for a significant reduction in the cost of the equipment to make a high power plasma cleaning equipment. Some etching applications such are polyimides, epoxy removal, photoresist stripping and descum. The Plasma-Preen can be used to clean wire bond pads, gold plated parts, ceramic substrates, glass parts, and semiconductor surfaces.

Capabilities:

• 2.45 GHz microwave power from 100 to 550 Watts maximum to the electrode.
• Substrate is water cooled.
• Two process gases are Argon and O2 with a 15 ml/min flow meter.
• The plasma chamber is configured with a 9” x 7” x 3” rectangular Pyrex and Aluminum chamber to accommodate a wide range of wafer sizes, piece parts, IC packages and other components.

Useful System Links

• plasmapreen.com

Equipment Use Fees

• Internal $30/hour External $60/hour
• Staff time: Internal: $40/hour External: $80/hour

Equipment Name: Temescal FC-1800 E-Beam Evaporator

Location: 358 ERC

Max Wafer Size: 6”

General Description: The Temescal FC-1800 E-Beam Evaporator is designed for material deposition by evaporation. Material types ranging from refractory metals to Quartz.

Capabilities:

• The CV-12SLX power supply is a 12 KW, constant voltage, high-frequency, switching electron beam supply which provides power to the 6 pocket e-gun.  The power supply delivers up to 10kV at 1200 mA, making it possible to achieve substantial deposition rates. The CV-12SLX provides stable output at all voltage levels and rapid arc recovery.
• The beam is positioned and the beam sweep is controlled with the TemEbeam Controller (EBC). The EBC also controls the rotation of the six pocket e-gun. The EBC enables the user to define beam position limits and to design ten operational sweep programs and up to 89 backup or virtual sweep programs per pocket.  Available sweep waveforms are sine, clipped, saw tooth, ramped, and arbitrary.
• A hand-held remote controller is used to configure sweep patterns while observing actual beam motion.  A joystick allows the user to control e-beam power, beam spot position, forward/reverse turret jogging, and sweep amplitude and frequency.
• Inficon XMC/3S crystal monitor is used for thickness monitoring.
• Load lock vacuum system with a CTI-8 Cryopump and 9600 compressor.
• Rotating planetary can hold up to four 6” substrates.

Equipment Use Fees

• Internal:  first metal ($40), second metal ($20 + 1st metal), third metal ($15 + 2nd metal), fourth metal ($10 + 3rd metal) plus material cost (most metals $3/100 Å and gold $25/100 Å)
• External: first metal ($80), second metal ($40 + 1st metal), third metal ($30 + 2nd metal), fourth metal ($20 + 3rd metal) plus material cost (most metals $6/100 Å and gold $30/100 Å).
• Staff time: Internal: $40/hour External: $80/hour

Equipment Name: Leybold ESV6 E-beam Evaporator

Location: 358 ERC

Max Wafer Size: 6”

General Description: The Leybold ESV6 E-Beam Evaporator is designed for material deposition by evaporation. Material types ranging from refractory metals to Quartz.

Capabilities:

• The ESV6 power supply is a 6 KW supply which provides power to the 4 pocket e-gun.
• The e-beam is steered with the two electromagnets for beam controller.
• Inficon crystal monitor used for thickness monitoring.
• Water cooled substrate holder for lift-off process.
• Substrate mounting for one 5” or 6” wafers, two 4” wafers, fours 3” wafers, and seven 2” wafers and multiple small pieces.

Equipment Use Fees:

• Internal:  first metal ($40), second metal ($20 + 1st metal), third metal ($15 + 2nd metal), fourth metal ($10 + 3rd metal) plus material cost (most metals $3/100 Å and gold $25/100 Å)
• External: first metal ($80), second metal ($40 + 1st metal), third metal ($30 + 2nd metal), fourth metal ($20 + 3rd metal) plus material cost (most metals $6/100 Å and gold $30/100 Å). 
• Staff time: Internal: $40/hour External: $80/hour

Equipment Name: Denton DV-502A Multicoater

Location: 358 ERC

Max Wafer Size: 4”

General Description: The Denton 502A is multicoater capable of thermal evaporation, e-beam evaporation, and DC sputtering. It can handle a wide variety of materials for evaporations required in various metalizing, optical coating and other applications.

Capabilities:

• 12" x 18" Pyrex bell jar with guard
• 12 cfm mechanical pump
• 400 lps turbo pump
• Inverted stage rotation
• Full range gauge
• 2 KVA evaporation with filament holders
• Denton DSM-300 300 watt DC supply for 4” sputter targets
• Denton Vacuum DEG-2 minigun power supply for e-beam evaporation
• Sycan STM-100 thickness monitoring system

Equipment Use Fees:

• Internal: $30/run plus material costs (most metals = $3/100Å and gold = $25/100Å)
• External: $60/run plus material costs (most metals = $6/100Å and gold = $30/100Å)
• Staff time: Internal: $40/hour External: $80/hour

Equipment Name: ESCI IKo FIBRotools Electroplating System

Location: 918C Rhodes Hall

Max Wafer Size: 6”

General Description: The IKo is designed simply to electroplate high-resolution interconnects and fine metallic features on wafers and substrates. FIBRoplate IKo is fabricated with PVC and polypropylene with a minimum of metal parts to avoid potential contamination of electroplating solutions. Metal features are stainless and titanium. All parts can be easily disassembled for maintenance.

Capabilities:

• Micro/macro uniformity <5% across the wafer
• Wafer size: 2" to 8"
• Simultaneously processes up to three 2" wafers
• Fast plating typically 1µm per minute
• Uses off-the-shelf chemistries with minimal additives
• Metals plated: Cu, Ni, Pd, Au, Sn, Pb, Pt, Fe, Ag, Permalloy, Sn/Pb, Pd/Ni
• Current DC and pulse average: 0.1A, 1.0A, and 3.0A
• Current peak: 0.3A, 3.0A, and 6.0A
• Voltage:  0 – 10V
• Programmable Timer: 4 digital realtime
• On/off timing: 0.01 mSec to 99 sec
• Heater:  Thermostat, 160F max., 550 Watt
• Solution Volume: 2.1 gallons/8 liters

Useful System Links:

• fibrotools.com

Equipment Use Fees:

• Internal $10/hour External $20/hour
• Staff time: Internal: $40/hour External: $80/hour

Equipment Name: Dymax 39060 UV Light-Curing Conveyor

Location: 918B Rhodes Hall

Max Wafer Size: 6”

General Description: The Dymax UVCS series conveyors are designed for curing UV-light curable adhesives, resins, inks, and coatings. These 12” wide conveyors can be outfitted with up to four Dymax 5000-EC lamps or up to two, six-inch microwave lamps. They offer complete shielding from UV light and consistent curing times. The lamp options allow matching intensity requirements to keep operating costs to a minimum.  Our current system has one UV 5000-EC lamp and power supply.

Capabilities:

• Complete UV shielding.
• Controlled and consistent cure times.
• Can accepts parts up to 6”x36”.
• 4”, 6”, or 10” vertical clearance available.
• 12” belt width (guides available to channel parts into center 6”)
• Maximum UVA Intensity (320-395 nm): 200 mW/ cm2
• Maximum UVA Energy(320-395 nm) @ 5 fpm: 1.25 J/cm2
• Line Speed: 1 to 27 fpm
• Built-in exhaust fan and stack.
• Integral vacuum hold-down and cooling system.
• Accurate digital belt control and readout.
• Adjustable lamp-to-belt distance.
• Bench-top conveyor.
• UV curing is used in a wide range of medical, electronic, industrial, aerospace, optical, automotive, packaging, and appliance applications.

Useful System Links:

• dymax.com

Equipment Use Fees

• Internal $10/hour External $20/hour
• Staff time: Internal: $40/hour External: $80/hour

Equipment Name: Mitsubishi 55MEtIII–2.5H Injection Molding

Location: 919 Rhodes Hall

Max Wafer Size: 10” x 9.06”

General Description: The injection molding process can produce parts from both thermoplastic, thermosetting plastic, and elastomers. Material is fed into a heated barrel, mixed, and forced into a mold cavity where it cools and hardens to the configuration of the cavity. Injection molding is widely used for manufacturing a variety of parts, for R&D settings and small manufacturing facilities.

Capabilities:

• Injection volume is 4.21 cubic inches.
• Injection capacity is 2.24 ounces.
• Injection rate is 11.296 cubic inches per second.
• Maximum injection pressure 34104 psi.
• Maximum holding pressure 25578 psi.
• Plasticizing Capacity 90.4 lb./hr.
• Mold clamping force of 55 ton with double toggle clamping type.
• Minimum mold thickness is 5.91 inch.
• Maximum mold thickness is 14.96 inch.
• Clearance between tie rods (H x V) 14.17” x 12.8”.
• Mold Size:  Minimum – 10” x 9.05” Maximum – 13.42” x 12.12”.
• User-friendly MAC-VIIIt controller with touch panel.
• Wave graphic display for injection and metering steps.

Useful System Links:

• mhiinj.com

Equipment Use Fees

• Internal $30/hour External $60/hour
• Staff time: Internal: $40/hour External: $80/hour

Equipment Name: Universal Laser Systems VLS3.50 laser cutting machine

Location: 918B Rhodes Hall

Description: The desktop VLS3.50 is small enough to fit on a work surface yet powerful enough to meet the requirements of on-demand production. Offering a material processing envelope of 24" x 12" x 4", 1,152 in3 (610 x 305 x 102 mm, 18,878 cm3), the VLS3.50 can be equipped with one of five ULS laser cartridges ranging in power from 10-50 watts. The VLS3.50 comes standard with Laser Interface+™ and a number of additional options are available to enhance your laser processing capabilities. All Universal laser platforms use interchangeable components, giving you the ability to tailor your system to fit your needs.

Capabilities:

• Work area: 24 x 12 in (610 x 305 mm).
• Laser power: 50W
• Maximum part size: 26.75 x 14.6 x 4 in (679 x 370 x 102mm).
• Rotary capacity:
  • Max Diameter 5 in (127 mm) with 1.5 in (38.1 mm) lens.
  • Min Diameter 1 in (25.4 mm) with 2 in (50.8 mm) lens.
• Motorized Z axis lifting capacity: 20 lbs (9 kg).
• Available Lenses: 2.0 in (51 mm).
• Laser Interface+™ software is a materials-based driver automatically determines the optimum processing settings for your target material. Just select the material type, enter in the material thickness, and start the laser system.
• High Power Density Focusing Optics (HPDFO) allow the laser beam to be focused to a much smaller spot, making it possible to engrave smaller text and produce sharper images at tighter tolerances.
• Software Controlled - The laser can be controlled by any software with a print function.
• Multi-Material - Process an endless number of materials available today and in the future.
• Multi-Process - Cut, engrave, mark, and produce photo images in one step.
• PC connection is a USB 2.0.

Useful System Links

• ulsinc.com/products/vls350

Equipment Use Fees

• Internal $10/hour External $20/hour
• Staff time: Internal: $40/hour External: $80/hour

Equipment Name: Wabash Press P3H-15-CLX

Location: 918B Rhodes Hall

Max Wafer Size: 12” x 12”

General Description: State-of-the-art hydraulic press for embossing and thermal bonding of plastics and composites. It can also be used for laminating in laboratory and R&D settings.

Capabilities:

• Pneumatic Clamp.
• Maximum platen temperature of 260° C.
• Independent temperature control of upper and lower platen.
• Water/Air cooled platen.
• 1000 to 6000 pound adjustable compression force.
• Six-inch stroke.
• 64 inch per minute closing and pressing speed.
• 100 inch per minute opening speed.
• ViewPoint control system including an Allen Bradley SLC 5/03 programmable controller, PanelView 550 touch screen, closed-loop control of pressure and platen temperature.
• Ammeters for heater burnout detection.

Equipment Use Fees

• Internal $30/run External $60/run
• Staff time: Internal: $40/hour External: $80/hour

Equipment Name: Western Magnum XRL-120 Hot Roll Laminator

Location: 918B Rhodes Hall

Max Panel Size: 12”

General Description: The XRL Series Hot Roll Laminators are designed to laminate Dry Film Photoresist to inner layers, multi-layer boards, double sided plated through-hole boards, chemical milling parts and other specialized substrate materials. Solid state, digital and programmable temperature controllers maintain constant temperatures across large diameter, dual driven and internally heated pressure rollers.  Air pressure cylinders provide the necessary contact pressure across the entire panel.

Capabilities:

• Lamination Speed: 0-12 feet per minute.
• 20 to 150 °C temperature controlled for both rolls.
• IR Temperature Sensors.
•  Panel Size: Width: 12" max.

Useful System Links

• westernmag.com

Equipment Use Fee:

• Internal $10/hour External $20/hour
• Staff time: Internal: $40/hour External: $80/hour

Equipment Name: Yasui Seiki Tabletop Mini-Labo™ Coater

Location: 918B Rhodes Hall

Standard Coating Width: 80 mm

General Description: This versatile bench-top test coating machine provides high quality coated web samples using the Microgravure method with a trailing blade.

Capabilities:

• Wet Coating Thickness: 1μ to 40μ, Dry Thickness:  70 Å (0.007μ) to 40 μ.
• Web: Thin (1.6 μ) PET to 7 mil (175 μ) thickness PET, paper, cloth, plastic webs, foils 5μ to 125μ thick, up to 140 mm width.  Maximum roll OD 200 mm.
• Cores: 3 inch standard cores, paper, plastic or metal, core length up to 150 mm.
• Coating: Standard width 80 mm.  
• Coating method: Yasui Seiki patented “Microgravure™” – Direct/Reverse/Kiss/Gravure method with trailing doctor blade.
• Web Speed: 0.2 to 2 m/min standard, optional speeds up to 1 to 10 m/min.
• Unwind/coating web tension and winding web tension adjustable.
• Dryer Temp: 160 + degree C (Hot Air Dryer).
• Photo Resist/Photo Mask layers, as thin as 0.05 microns
• PSA and Thermal adhesive layers, as thin as .5 microns (thinner possible).
• Coating onto clear/conductive layers, ie: ITO without scratches.
• Insulating layers, multi-layer circuit boards, and laminations.
• Diffusion screens for backlight LCD displays.
• Various layers for LCD and OLED displays.
• Silicone Release and other release polymer films.
• Anti-static, other clear conductive polymer layers.
• Analog and digital magnetic tapes for audio, video tapes, and computer data storage.
• Hard coat for touch screen displays.
• Hot stamping foils for LCD pixels.

Useful System Links

• yasui.com
• mirwecfilm.com

Equipment Use Fees:

• Internal $10/hour External $20/hour
• Staff time: Internal: $40/hour External: $80/hour

Equipment Name: Nanonex NX-2600 Nanoimprint Lithography

Location: 353 ERC

Max Wafer Size: 6”

General Description: The Nanonex NX-2600 is a full wafer nanoimprinter and photolithography aligner. It is capable of all imprint forms: thermal, photo-curable, embossing and photolithography, with sub-5nm imprinting resolution and sub-1 micrometer alignment accuracy.

Capabilities:

• Thermal Imprint Module: temperature range room temperature to 250 °C, heating rate greater than 300 °C/minute, cooling rate greater than 150 °C/minute, pressure range 0 to 3.45 MPa applied by a double sided air cushion pressTM (ACP).
• Photo Imprint Module: integrate UV exposure source at a wavelength of 320 – 390 nanometers, lamp power is 200 W, pressure range 0 to 3.45 MPa applied by a double sided air cushion pressTM (ACP), and an alignment stage with better than 1 micron layer to layer accuracy.
• 5” x 5” or 6” diameter mask holders for alignment of 2”, 3”, or 4” substrates for lithography or UV curing.
• Smart sample holder for thermal imprinting of arbitrary shaped samples.
• Dual CCD cameras for alignment optics and split screen display. 

Equipment Use Fees: 

• Internal $30/hour External $60/hour
• Staff time: Internal $40/hour External $80/hour

Equipment Name: EVG 620 Mask Aligner

Location: 918B Rhodes Hall

Wafer Size: 2” - 6”

General Description: The EVG 620 is a full wafer photolithography aligner. Known for its high level of automation and reliability, the EVG 620 is designed for optical lithography and precision alignment up to 150 mm wafer sizes. An ultra-soft wedge compensation together with a computer controlled contact force between the mask and wafer ensures that both yield and mask lifetime are dramatically increased. The system safely handles thick, bowed or small diameter wafers. The EVG620 superior alignment stage design achieves highly accurate alignment and exposure results while maintaining high throughput.

Capabilities: 

• Mask size: 5 inch and 7 inch
• Wafer thickness:  0.1 – 10 mm
• Range of alignment: X, Y ± 5mm and Theta ± 3°
• Microscope movements are performed by fully motorized, actuated by analog 3 axis joystick and substrate movement is performed with high precision micrometers for X, Y, Theta axis resolution of 0.1μm
• Alignment accuracy: 0.5μm for top side alignment (with 20x objectives)1μm for top to bottom side alignment (with ≥10x objectives)
• Exposure modes: soft contact, hard contact, vacuum contact, and proximity contact (0 – 300 µm exposure gap)
• Print resolution: Contact force: 2N: < 2μm 10N: 1 – 1.5μm, Hard contact: 300mbar: 0.8 – 1.5μm, Proximity: 5μm gap: 1 – 2.5μm, 10μm gap: 1.5 - 3μm. 15μm gap: 1.8 – 3.5μm, 30μm gap: 2.5 - 5μm, and Vacuum contact: 0.6μm
• 350 mercury arc lap with a UV light uniformity of 100mm: ± 2%, 150mm: ± 3% for 365 nm and 405 nm wavelength
• Dual high resolution B&W CCD cameras for alignment optics and split screen display. 

Equipment Use Fees:

• Internal $10/hour External $30/hour
• Staff time: Internal $40/hour External $80/hour

Equipment Name: Karl Suss MJB 3 Mask Aligner

Location: 354 ERC

Max Wafer Size: 3”

General Description: The MJB 3 is designed for high resolution photolithography in a laboratory or pilot plant production. It offers flexibility in handling of irregularly shaped substrates of differing thickness as well as standard sized substrates up to 3” diameter. 

Capabilities:

• Mask size: 2.5 inch 3 inch and 4 inch
• Substrate sizes:  pieces to 75 mm
• Range of alignment: X, Y ± 10mm and Theta ± 10°
• Substrate movement is performed with high precision micrometers for X, Y, and Theta axis resolution of 0.1μm
• Alignment accuracy: 0.1μm for top side alignment (with 20x objectives)
• Exposure modes: soft contact, hard contact, and vacuum contact
• Print resolution: Soft contact: 1.0 – 2.0μm Hard contact: 0.8 – 1.5μm,  and Vacuum contact: 0.6μm
• 350 mercury arc lap with a UV filters for 365 nm and 405 nm wavelength

Equipment Use Fees:

• Internal $10/hour External $30/hour
• Staff time: Internal: $40/hour External: $80/hour

Equipment Name: Solitec 3000IR Mask Aligner

Location: 354 ERC

Max Wafer Size: 4”

General Description: The 3000IR is designed to provide precise, repeatable mask alignment and exposure for photolithography in a laboratory.  It offers all the functions necessary to produce high quality patterns on materials which can have a wide range of physical size and photolithographic properties.

Capabilities:

• Mask size: 3 inch, 4 inch and 5 inch
• Substrate sizes:  pieces to 100 mm
• Range of alignment: X, Y ± 12.7mm and Theta ± 45°
• Substrate movement is preformed with high precision micrometers for X, Y, and Theta axis resolution of 0.3μm
• Alignment accuracy: 0.3μm for top side alignment
• Mask rotation: ±3°
• Exposure modes: proximity and vacuum contact adjustable
• Infrared camera for backside wafer alignment
• 350 mercury arc lap with a UV filters for 365 wavelength
• Split field pneumatic microscope for alignment using 5X objectives

Equipment Use Fees 

• Internal $10/hour External $30/hour
• Staff time: Internal $40/hour External $80/hour

Equipment Name: Alessi REL-2500 Semi-Automatic Probe Station

Location: 361 ERC

Max Wafer Size: 6”

General Description: The REL-2500 probe station is design for semi-automatic stage movement in the X and Y direction for precise die movement and rapid measurement such as failure analysis, device characterization, process monitoring, and reliability testing applications.

Capabilities:

• Stage has a 6” vacuum chuck with semi-automatic movement in X and Y direction and manual movement in Z and theta directions
• Probe card adapter for 48 pin edge cards
• Six magnetic probes are available with X, Y, Z, and Theta movement.  Z direction has 100 threads/inch capabilities for fine adjustment. Seven and 25 micron diameter probe tips for fine and course probing
• Mitutoyo FS60 optics with X and Y course/fine movement, 1 to 2X zoom, objectives 2X, 10X, and 20X with long working distances
• Computer controlled instruments uses LabVIEW 2010 and a GPIB card for data gathering

Equipment Use Fees:

• Internal $10/hour External $20/hour
• Staff time: Internal: $40/hour External: $80/hour

Equipment Name: Alessi REL-3200 Manual Probe Station

Location: 361 ERC

Max Wafer Size: 6”

General Description: The REL-3200 probe station is design for precise stage movement of substrates and probes for ease of use in everyday failure analysis, device characterization, process monitoring, and reliability testing applications.

Capabilities:

• Stage has a 6” vacuum chuck with movement in X, Y, Z, and theta directions
• Heated 6” chuck
• Probe card adapter for 48 pin edge cards
• Six magnetic probes are available with X, Y, Z, and Theta movement.  Z direction has 100 threads/inch capabilities for fine adjustment. Seven and 25 micron diameter probe tips for fine and course probing
• Mitutoyo FS60 optics with X and Y course/fine movement, 1 to 2X zoom, objectives 2X, 10X, and 20X with long working distances
• Light tight enclosure
• Computer controlled instruments uses LabVIEW 2010 and a GPIB card for data gathering

Equipment Use Fees:

• Internal $10/hour External $20/hour
• Staff time: Internal: $40/hour External: $80/hour

Equipment Name: Micromanipulator 6200 Manual Probe Station

Location: 361 ERC

Max Wafer Size: 4”

General Description: The 6200 probe station is design for precise stage movement of substrates and probes for ease of use in everyday failure analysis, device characterization, process monitoring, and reliability testing applications.

Capabilities:

• Stage has a 4” vacuum chuck with movement in X, Y, Z, and theta directions
• Heated 4” chuck
• Five vacuum probes are available with X, Y, Z, and Theta movement
• Bausch and Lomb Microzoom II optics with X and Y movement, 1 to 2X zoom, objectives are 2.25X, 8X, and 25X with long working distances
• Vibration isolation table
• Computer controlled instruments uses LabVIEW 2010 and a GPIB card for data gathering

Equipment Use Fees: 

• Internal $10/hour External $20/hour
• Staff time: Internal: $40/hour External: $80/hour

Equipment Name: AG Associates Heatpulse 410 Rapid Thermal Processor

Location: 364 ERC

Max Wafer Size: 4”

General Description: The Heatpulse 410 uses high intensity visible radiation to heat single substrates for short periods at precisely controlled temperatures. Some of the applications of the Heatpulse 410 are ion implantation activation, polysilicon annealing, contact alloying, GaAs processing, and Silicide formation.

Capabilities:

• Recommended steady state temperature: 400 - 1150°C.  Minimum temperature is 300°C and maximum temperature is 1350°C
• Steady state temperature stability: +/- 7°C
• Temperature monitoring: Thermocouple
• Heating rate: 10 - 300°C recommended 220°C
• Cooling Rate: Temperature dependent. Maximum 80°C/second
• Steady state time: 1 – 9999 seconds ( 1- 300 seconds recommended)
• Radiant flux: ±0.25%
• Substrate sizes: pieces through 4”
• Process gases: Nitrogen and forming gas (4% H2 balance N2)
• Computer controlled

Equipment Use Fees:

• Internal per run: $30/run internal $60/run external
• Staff time: Internal: $40/hour External: $80/hour

Equipment Name: Suss RCD8 Gen 3 Spin Coater

Location: 918B Rhodes Hall

Max Wafer Size: 2” - 8” round or 2” – 6” square

General Description: The RCD8 is a basic manual spin coater with the GYRSET® technology serving daily R&D work up to small scale production. The patented GYRSET® rotating closed cover coating technology is integrated into the RCD8 spin coating module. For various photoresists and applications, the GYRSET® technology enables a wider process window.  During the process the cover is closed creating a solvent saturated atmosphere.  All of the substrate dependent parts, including the air, are locked into the cover and rotate synchronously. This ensures that any turbulence is ruled out and the coating is distributed evenly across the surface of the substrate. The control software is SUSS MMC Tool Control software based on Windows XP. The touchscreen GUI (Graphical User Interface) monitors performance and status of the entire machine.

Capabilities:

• Manual substrate handling and centering.
• Maximum number of process steps is 60.
• Open bowl coating – maximum spin speed is 6000 RPM and spin acceleration of 1 – 6000 RPM/second.  Programmable increments of 1 RPM.
• GYRSET coating – maximum spin speed is 3000 RPM and spin acceleration of 1 – 3000 RPM/sec.  Programmable increments of 1 RPM.

Useful System Links:

• suss.com

Equipment Use Fees

• Internal $10/hour External $30/hour
• Staff time: Internal: $40/hour External: $80/hour

Equipment Name: Denton Discovery 24 Sputtering System

Location: 358 ERC

Max Wafer Size: 6”

General Description: The Denton Discovery 24 Sputtering System can deposit a wide range of metals, dielectrics, optical coatings, and protective layers.

Capabilities:

• Load lock has automated electric cassette elevator with positive sense of wafer position and occupancy for 8-position cassettes.
• Four 3” diameter internal planar magnetron sputter sources with RF/DC capability, variable source to substrate distance, and clamp/bond target capability.
• Dressler Cesar 136 RF power supply (600 watt output), coupled to a Dressler Variomatch VM700A automatic match network.
• Two Advanced Energy MDX1.5K kW (1.5 kW) DC power supply.
• ENI RPG-50 (5.0 kW) pulsed power supply
• RF stage biased with a Dressler Cesar 136 RF power supply (600 watt output) coupled to a Dressler Variomatch VM700A automatic match network.
• Substrate heater with a 800C maximum.
• Process gases are Argon, Oxygen, and Nitrogen.
• A wide variety of different sized substrates can be mounted to a 6” silicon wafer.

Equipment Name: Nanometrics 210XP

Location: 361 ERC

Max Wafer Size: 6”

General Description: The 210XP employs the principle of optical interferometry to measure film thickness.  White light is reflected from the film substrate system passes through an entrance aperture and is reflected again from a diffraction grating.  The grating disperses the white light into its component wavelengths over a range of 390 nm to 800 nm.  The 210XP includes a linear wavelength display, a photo intensity display and the spectrophotometer head is mounted on a custom microscope with vertical reflected light illumination.  It offers fast measurements, a broad thickness range, precise thickness values, comprehensive statistics programs, and relative reflectance. 

Capabilities:

• Film Types: thin and thick oxides on Si, thin and thick nitrides on Si, negative or positive resist on Si and oxide, positive resists on oxide and Si, polysilicon on oxide, and polyimide on Si
• Thickness measurement range: less than 100 Å  to 1,000,000 Å
• Objective range: 5X, 10X, and 50X
• Spot sizes:  70 µm with 5X objective, 35 µm with 10X objective, and 7 µm with 50X objective
• Reproducibility: ±2% to ±4%
• Typical measurement time: 15 seconds

Equipment Use Fees: 

• Internal $30/hour External $60/hour
• Staff time: Internal: $40/hour External: $80/hour

Equipment Name: Bruker ContourGT-K1 3D Optical Microscope

Location: 918B Rhodes Hall

Max Wafer Size: 6”

General Description: Utilizing white and green light interferometry, the ContourGT-K1 performs fast, three-dimensional surface measurements from nanometer-scale roughness through millimeter-scale steps, with sub-nanometer resolution. The combination of the easy measurement setup, fast data acquisition, 6-inch automated stage, and small footprint allow the ContourGT-K1 to deliver 3D surface metrology performance demanded by small research labs.

Capabilities:

• Phase Shift Interferometry and Vertical Shift Interferometry modes.
• Six inch automated X-Y stage with manual tip tilt.
• Stitching capability synthesizes thousands of individual datasets into one continuous image.
• Sub-nanometer to10mm vertical measurement range.
• A 640x480 high speed camera can capture 60fps.
• Up to 28um/sec scan speeds.
• A motorized turret can accommodate up to 5 interferometric objectives.
• Objectives: 5X interferometric objective with a 9.36 mm working distance, 10X interferometric objective with a 7.4 mm working distance 50X interferometric objective with a 3.4 mm working distance, and a 10X TTM objective with a working distance of 8.5 – 9.5 mm.

Useful System Links:

• bruker.com

Equipment Use Fees:

• Internal $30/hour External $60/hour
• Staff time: Internal $40/hour External $80/hour

Equipment Name: KLA Tencor P-15 Profilometer

Location: 361 ERC

Max Wafer Size: 8”

General Description: The KLA-Tencor P-15 Profiler is a highly sensitive surface profiler that measures step height, roughness, and waviness on sample surfaces. Roughness can be measured with up to a 0.5 Å resolution over short distances. Waviness can be measured over the entire surface of a sample. The P-15 system uses stylus-based scanning to achieve high resolution and can correlate local submicron features with global surface measurements. It has a scan area of 200 X 200 mm.

Capabilities:

• Microscopic and Macroscopic Feature Resolution: Combines macroscopic and microscopic surface analysis, and measures features as small as 0.25 μm.
• Correlation Scanning:  Provides a data reference for comparing the measurements of multiple microscopic features by re-scanning portions of a macroscopic long scan on the microscopic scale.
• Die Grid Navigation: Offers an alternative method to that of positioning the sample by XY coordinates. Instead, it selects die location for measuring lithographic patterns in different dies.
• 3D imaging.

Acceptable substrate materials are flat metal, glass, paper, plastics, ceramic, and semiconductors.

Equipment Use Fees:

• Internal $30/hour External $60/hour
• Staff time: Internal: $40/hour External: $80/hour

Equipment Name: Denton DV-502A Multicoater

Location: 358 ERC

Max Wafer Size: 4”

General Description: The Denton 502A is multicoater capable of thermal evaporation, e-beam evaporation, and DC sputtering. It can handle a wide variety of materials for evaporations required in various metalizing, optical coating and other applications.

Capabilities:

• 12" x 18" Pyrex bell jar with guard
• 12 cfm mechanical pump
• 400 lps turbo pump
• Inverted stage rotation
• Full range gauge
• 2 KVA evaporation with filament holders
• Denton DSM-300 300 watt DC supply for 4” sputter targets
• Denton Vacuum DEG-2 minigun power supply for e-beam evaporation
• Sycan STM-100 thickness monitoring system

Equipment Use Fees:

• Internal: $30/run plus material costs (most metals = $3/100Å and gold = $25/100Å)
• External: $60/run plus material costs (most metals = $6/100Å and gold = $30/100Å)
• Staff time: Internal: $40/hour External: $80/hour

Equipment Name: Denton DV-515 Evaporator

Location: 366 ERC

Max Wafer Size: 6”

General Description: The Denton 515 evaporator power supply is used for the evaporation of carbon for use in electron microscope specimen preparation.

Capabilities:

• 12" x 12" Pyrex bell jar with guard
• 15" diameter stainless steel base plate
• 8 cfm mechanical pump
• 30 lps turbo pump
• Stage rotation
• Full range gauge

Equipment Use Fees:

• Internal: $30/run
• External: $60/run
• Staff time: Internal: $40/hour External: $80/hour