Metasonics Lab

The Metasonics lab specializes in acoustic sensors and systems for the Internet of Things. We use sound to wirelessly power and communicate with sensors in extreme environments, such as deep oceans, within the human body, and inside nuclear waste containers. Our group uses 3D printing to build advanced materials and technologies for generating, precisely manipulating, and harvesting ultrasonic waves. We build next-gen acoustic devices and systems, such as lenses, SONAR, and ultrasound imagers. These devices are used for a variety of applications, ranging from non-destructive testing to biomedical imaging.

Research Areas

Wireless Ultrasonic Charging and Communication

graphic depicting projector sending acoustic power to an ultrasonic transducer which powers a sensor for low-power electronics of an IoT device which then sends data back to a receiver

 

We use ultrasound to wirelessly power and communicate with battery-free sensors in challenging environments such as the ocean, nuclear waste containers, and space. We aim to scale this technology for widespread environmental monitoring, enabling real-time insights into underwater circulation, water quality, and infrastructure health.

Wave Control and Metamaterials

Using 3D printing, we design advanced materials that manipulate sound waves in ways not possible with natural materials. These metamaterials efficiently focus acoustic energy, improving power harvesting and high-resolution imaging in water, air, and solids. Our work enables more efficient energy transfer, enhanced acoustic sensing, and new capabilities in ultrasound-based diagnostics.

graphic depiction of sound waves moving over an object
graphic depiction of sounds waves changing after moving over an object

Acoustic Sensing and Imaging

an image of a scanning laser vibrometer with graphic depicting how it measures vibrations on a surface via scan, creating a detailed ultrasonic image

 

We cross disciplines to build ultrasonic systems that push the imaging resolution of ultrasound, make it accessible, and enable new applications. For example, our contactless ultrasonic NDT technology ensures the rapid, safe production of critical aircraft parts using additive manufacturing techniques.

Learn More

For the most up to date information regarding our current research projects, publications, team, available positions, and contact information, please visit the Metasonics lab website.

Faculty

Headshot of Ahmed Allam

Ahmed Allam

Asst Professor, CEAS - Mechanical Eng

685 Rhodes Hall

513-556-1998

Ahmed Allam is an Assistant Professor at the Mechanical and Materials Engineering Department. He heads the UC Metasonics Lab, and his research interests include acoustics and ultrasonics, 3D-printed materials, underwater communications, IoT, in-body...

Ahmed Allam is an Assistant Professor at the Mechanical and Materials Engineering Department. He heads the UC Metasonics Lab, and his research interests include acoustics and ultrasonics, 3D-printed materials, underwater communications, IoT, in-body sensing, and industrial monitoring. He is the author of over 20 journal and conference publications in acoustics, communications, applied physics, and non-destructive testing.

The Metasonics lab specializes in acoustic materials, transducers, and systems for emerging domains such as the Internet of Things and Industry 4.0. We use sound and ultrasound for sensing, communication, and power transfer in challenging environments such as deep in the ocean, in the human body, and in nuclear waste containers. Our group designs and builds acoustic devices, circuits, and signal processing software to generate acoustic and ultrasonic waves, control their propagation, and convert them to useful electrical signals. We use 3D printing to design metamaterials that control acoustic wave propagation and use these metamaterials to build acoustic devices such as lenses, matching layers, and collimators. We also combine 3D printing and metamaterials to design novel piezoelectric (ultrasonic) transducers for novel applications.